Finishing — Tin

Tin plating
matte & bright.

Electrodeposited tin for aluminum, steel, brass, bronze, and copper — solderable, electrically conductive, and corrosion-resistant.

Licensed Engineering Firm ISO 9001:2015 Certified ITAR Registered Production & High-Mix, Low-Volume Veteran-Owned · Van Alstyne, TX

The electronics workhorse

Tin plating deposits a layer of pure tin that is solderable, electrically conductive, and corrosion-resistant — widely used in electronics, electrical connectors, bus bars, and RF components where solder adhesion and low contact resistance are critical. Coordinated through our trusted finishing vendors in matte and bright options.

Matte vs. bright

Bright tin is the familiar shiny finish on consumer electronics components. Matte tin has a larger grain structure that is significantly less prone to tin-whisker growth — the microscopic filaments that can short tight-pitch electronics over time. Aerospace, defense, and medical electronics specs commonly require matte tin for exactly this reason.

  • Matte tin — reduced whisker risk, preferred for high-reliability electronics
  • Bright tin — smooth, reflective surface for general electrical applications
  • Excellent solderability and low contact resistance
  • Good corrosion resistance for electrical assemblies

Substrates and pairings

Tin plates readily onto copper, brass, and bronze; steel for corrosion protection; and aluminum with an appropriate underplate. A natural finishing step for our electronics machining work — for uniform coating in complex internal geometry, see electroless nickel.

FAQ

Frequently asked questions

Matte tin has a larger grain structure significantly less prone to tin-whisker growth. Whiskers are microscopic filaments that can grow from bright tin over time and short tight-pitch electronics. Aerospace, defense, and medical specs commonly require matte tin for this reason.

Yes. Tin is inherently solderable — a primary reason it is specified for connectors, terminals, and RF components. Properly plated surfaces solder with minimal flux and maintain adhesion over the part’s service life.

Yes, with an appropriate underplate (typically a zincate or nickel strike) for adhesion. We coordinate this at the process level — send your drawing and we’ll confirm the substrate and steps.

Connector applications typically specify 0.0001" to 0.0003" (100–300 micro-inches); corrosion-protection applications may call for heavier deposits. We plate to your specification.

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ISO 9001:2015ITAR RegisteredVeteran-OwnedTX Van Alstyne